TRION: PECVD & RIE

Description

This system uses di-ethyl silane (DES), NH₃, N₂, N₂O for the PECVD deposition of Si₃N₄ and SiO₂.  It is also used as an RIE etcher for these materials with CF₄/O₂ chemistry as well as for O₂ ashing/descum.

Operation

See PECVD Standard Operation Procedure for Deposition and Etching